High Performance Analog and Mixed-Signal - Amplifiers and Comparators, Data Converters, Interface Products, Power Management, Audio, Clock and Timers, Control and Monitoring, MSP430, RF. Telecom, Video and Imaging.
DSP - High Performance (C6000), Power Efficient (C5000), Control Optimized (C2000) and RISC(ARM)/DSP integrated products (OMAP) w/ eXpress DSP support software.
Standard Linear & Logic - Industry leader in all logic functions (AUC, GTLP, Little Logic, AVC, ALVT, CBTLV, AHC, ALVC, CBT, LV, LVC, LVT, GTL, FB+, ABT, FCT, AC, BCT, HC, ALS, F, AS, CD4000, LS, S, TTL and full spectrum of process technologies(CMOS, BiCMOS, Bipolar)

The world’s pioneer of system-on-a-programmable-chip (SOPC) solutions, offering programmable logic devices and field-programmable gate arrays . Altera combines this technology with our Quartus II comprehensive SOPC design environment. Stratix device family offering up to 180k logic elements (LE's), 9K of embedded memory, optimized digital signal processing (DSP) blocks, and high-performance I/O capabilities. HardCopy- hard wire cost reduction for Stratix and other high density Altera FPGAs. Cyclone device family is the lowest price, high density, FPGA on the market- capable of replacing ASIC's in high volume applications. NIOS 32 bit microprocessor soft core with open licensing and optimized for Altera FPGA's. MAX/MAXII device family of PLD products leading the industry in price and performance.

Memory solutions for industrial, mobile, and advanced computing applications: DRAM (DDR I/II), DRAM Modules, SRAM (DDR I/II, QDR), NAND Flash and special packaging by Die Delivery and Services Corp

IBM foundry services, semiconductor design and manufacturing. IBM Foundry offers a range of leading-edge and industry-standard CMOS (copper interconnects and silicon-on-insulator (SOI)), RF CMOS (High frequency efficiency in a low cost solution), Silicon Germanium (high performance with low noise and low power) and BiCMOS process technologies ranging in transistor size from 0.5-µm to 45-nm.

IBM Global Engineering Solutions (GES) utilizes IBM’s technology and engineers to collaborate with their clients to accelerate the pace of innovation and to assist them in differentiating their products.

Founded in 1973, Gennum Corporation designs, manufactures, and markets leading-edge semiconductor and semiconductor-based solutions for prominent segments of the global video and data communications industries. Integrated circuit and modular Interconnect solutions for Video applications include -  3Gb/s SDI / HD-SDI / SD-SDI / DVB-ASI, HDMI, DVI and Display Port standards and interfaces.

Tundra Semiconductor Corporation, is the global leader in System Interconnect providing world-class customer support, leading-edge semiconductor solutions and design services to the world's foremost communications, networking, storage system, and information technology vendors. With over a decade of supporting industry standards such as PCI, PCI-X, PCI Express®, RapidIO®, VME and HyperTransport™, Tundra has developed a core competency in System Interconnect. Tundra’s products deliver the system performance and low power consumption customers need to reduce development time and risk, maximize system performance and accelerate time-to-market.